Fork-Coupled Resonators for Characterization of Mold Material for 5G Applications

The dielectric properties of materials applied in advanced packaging technologies such as Fan-out Wafer Level Packaging (FoWLP) must be precisely known at millimeter-wave (mm-Wave) frequencies for optimized package design. In this paper, the applicability of fork-coupled resonators for the electromagnetic characterization of an epoxy molding compound (EMC) for 5G applications is investigated. The analysis is experimentally verified by means of measurements of fabricated test structures on EMC (Nagase R4601-X65) material for 5G applications in frequency bands of 26.5-29.5 GHz and 37-40 GHz.