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The European 3D Heterogeneous Integration Platform (e-BRAINS) - A particular focus on reliability and low-temperature processes for 3D Integrated Sensor Systems
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2015
Conference Paper
Title
The European 3D Heterogeneous Integration Platform (e-BRAINS) - A particular focus on reliability and low-temperature processes for 3D Integrated Sensor Systems
Author(s)
Ramm, P.
Klumpp, A.
Weber, J.
Mathewson, A.
Razeeb, K.M.
Pufall, R.
Mainwork
11th International Conference and Exhibition on Device Packaging 2015
Conference
International Conference and Exhibition on Device Packaging (DPC) 2015
Language
English
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
