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  4. Failure mechanisms in AlGaAs/GaAs HEMTs
 
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1995
Journal Article
Title

Failure mechanisms in AlGaAs/GaAs HEMTs

Other Title
Versagensursachen in AlGaAs/GaAs HEMTs
Abstract
Failure mechanisms in AlGaAs/GaAs high electron mobility transistors (HEMTs) life tested under high temperature storage, high temperature with d.c. bias, and high temperature with d.c. bias under r.f. drive have been determined to differ significantly. Monte Carlo modeling has been used to explain the experimental data, which shows evidence of gate sinking, ohmic contact degradation, and trapped charge formation near the two-dimensional gas (2DEG). Of particular interest is the evidence of damage from hot carriers under the stress conditions of high temperature with d.c. bias under r.f. drive, which most closely simulates actual use conditions.
Author(s)
Christianson, K.A.
Moglestue, C.
Anderson, W.T.
Journal
Solid-State Electronics  
DOI
10.1016/0038-1101(95)00058-2
Language
English
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Keyword(s)
  • aluminium compounds

  • failure analysis

  • gallium arsenide

  • hot carriers

  • life testing

  • Monte Carlo methods

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