Characterization of strength properties of thin polycrystalline silicon films for MEMS applications

The aim of this work is to characterize the strength properties of polycrystalline silicon (polysilicon) with the use of tensile and bending test specimens. The strength of thin polysilicon films with different geometry, size and stress concentrations has been measured and correlated with the effective size of the specimen and its stress distribution. The test results are evaluated using a probabilistic strength approach based on the weakest link theory with the use of STAU software. The use of statistic methods of strength prediction of polysilicon test structures with a complex geometry and loading based on test values for standard material tests specimen has been evaluated.