2007
Conference Paper
Title

Printing solder paste in dry film - A low cost fine-pitch bumping technique

Author(s)
Baumgartner, T.
Manessis, D.
Töpper, M.
Hauck, K.
Ostmann, A.
Reichl, H.
Goncalo, C.T.
Jorge, P.
Yamada, H.
Mainwork
Conference
DOI
Language
English