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The role of Au/Sn solder in packaging
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2005
Conference Paper
Title
The role of Au/Sn solder in packaging
Author(s)
Oppermann, H.
Mainwork
Materials for Information Technology: Devices, Interconnects and Packaging
Conference
Biennial meeting of the Federation of European Materials Societies (FEMS) 2003
DOI
10.1007/1-84628-235-7_31
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
