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3D integration technologies for MEMS based on copper TSVs and copper-to-copper metal thermo compression bonding
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2013
Conference Paper
Title
3D integration technologies for MEMS based on copper TSVs and copper-to-copper metal thermo compression bonding
Author(s)
Hofmann, Lutz
Baum, Mario
Schulz, Stefan E.
Wiemer, Maik
Geßner, Thomas
Mainwork
Advanced Metallization Conference 2013
Conference
Advanced Metallization Conference (AMC) 2013
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS
