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Integration technology parameters for physical design of vertical system-in-package
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2006
Conference Paper
Title
Integration technology parameters for physical design of vertical system-in-package
Author(s)
Polityko, D.
Guttowski, S.
Reichl, H.
Mainwork
ECTC 2006, the 56th Electronic Components and Technology Conference. Proceedings. CD-ROM
Conference
Electronic Components and Technology Conference (ECTC) 2006
DOI
10.1109/ECTC.2006.1645839
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
