Fugen in kleinsten Dimensionen - Einsatz der Klebetechnik in der Mikroelektronik

Adhesive bonding technology can be used for the production of close joints with a good load-carrying capacity and long-term stability, e.g. in microelectronics. Adhesive bonding renders possible the combining of different materials. The minaturization of the components are the fine-pitch optimizazion are no problems. Soldering technology limits the innovative development.