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  4. 1.3 mu m BH-FP laser with integrated monitor photodiode, 45 degrees reflector for bottom side emission employing full on-wafer fabrication
 
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2002
Conference Paper
Title

1.3 mu m BH-FP laser with integrated monitor photodiode, 45 degrees reflector for bottom side emission employing full on-wafer fabrication

Abstract
We report on a 1.3 mu m FP-BH laser with monolithically integrated monitor photodiode and 45 degrees reflector for bottom side emission of the laser light. The devices are fabricated by employing a full on-wafer process including the formation of laser facets and the deposition of the high/antireflective coatings. Besides the possibility of on-wafer characterization, this device with its bottom side optical emission opens the way for the fabrication of low-cost optoelectronic modules based on semiconductor SMT-package technique.
Author(s)
Janiak, K.
Albrecht, P.
Fidorra, S.
Heidrich, H.
Rehbein, W.
Roehle, H.
Althaus, H.-L.
Mainwork
IPRM, 14th Indium Phosphide and Related Materials Conference. Conference proceedings  
Conference
International Conference on Indium Phosphide and Related Materials (IPRM) 2002  
DOI
10.1109/ICIPRM.2002.1014086
Language
English
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
Keyword(s)
  • antireflection coatings

  • fabry-perot resonators

  • laser cavity resonators

  • photodiodes

  • semiconductor device packaging

  • semiconductor lasers

  • surface mount technology

  • integrated monitor photodiode

  • bottom side emission

  • full on-wafer fabrication

  • laser facets

  • antireflective coatings

  • low-cost optoelectronic modules

  • smt-package technique

  • 1.3 micron

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