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Mixed mode interfacial fracture toughness evaluation for flip chip assemblies and CSP based on fracture mechanics approaches
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2001
Conference Paper
Title
Mixed mode interfacial fracture toughness evaluation for flip chip assemblies and CSP based on fracture mechanics approaches
Author(s)
Auersperg, J.
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Kieselstein, E.
Schubert, A.
Michel, B.
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Mainwork
Threaded and riveted connections, design issues, reliability, design issues, reliability stress analysis, and failure prevention
Conference
International Mechanical Engineering Congress and Exposition (IMECE) 2001
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
