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  4. High-Resolution Radioscopy and Tomography for Light Materials and Devices
 
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2000
Conference Paper
Titel

High-Resolution Radioscopy and Tomography for Light Materials and Devices

Abstract
New manufacturing techniques and innovative materials, nowadays used in modern product design and fabrication, require elaborated quality control methods by non-destructive testing (NDT). Prominent examples for the needs of high-performance characterization and quality control methods are advanced structured materials (e.g. composites, organic and metallic foams) and microelectronics (e.g. flip-chips, glob-tops). In many cases, the fine structure in those material categories demands the highest spatial resolution achievable. Especially in microelectronics, the recent and upcoming advances in miniaturization will impose the needs for progress in methods of non-destructive testing. The growing number of connections in electronic circuits and components will result in a poor yield if no innovative testing methods would be applied.
Author(s)
Helfen, L.
Baumbach, T.
Banhart, J.
Stanzick, H.
Cloetens, P.
Ludwig, W.
Baruchel, J.
Hauptwerk
15th World Conference on Nondestructive Testing 2000
Konferenz
World Conference on Non-Destructive Testing 2000
DOI
10.24406/publica-fhg-335843
File(s)
001.pdf (468.08 KB)
Language
English
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Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren IZFP
Tags
  • micro-tomography

  • radiography

  • phase contrast

  • light material

  • composite

  • foam

  • fiber material

  • flip-chip

  • solder bump

  • metallization layer

  • hidden structure

  • wire bonding

  • glob top

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