High-Resolution Radioscopy and Tomography for Light Materials and Devices
New manufacturing techniques and innovative materials, nowadays used in modern product design and fabrication, require elaborated quality control methods by non-destructive testing (NDT). Prominent examples for the needs of high-performance characterization and quality control methods are advanced structured materials (e.g. composites, organic and metallic foams) and microelectronics (e.g. flip-chips, glob-tops). In many cases, the fine structure in those material categories demands the highest spatial resolution achievable. Especially in microelectronics, the recent and upcoming advances in miniaturization will impose the needs for progress in methods of non-destructive testing. The growing number of connections in electronic circuits and components will result in a poor yield if no innovative testing methods would be applied.