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  4. High-Resolution Radioscopy and Tomography for Light Materials and Devices
 
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2000
Conference Paper
Title

High-Resolution Radioscopy and Tomography for Light Materials and Devices

Abstract
New manufacturing techniques and innovative materials, nowadays used in modern product design and fabrication, require elaborated quality control methods by non-destructive testing (NDT). Prominent examples for the needs of high-performance characterization and quality control methods are advanced structured materials (e.g. composites, organic and metallic foams) and microelectronics (e.g. flip-chips, glob-tops). In many cases, the fine structure in those material categories demands the highest spatial resolution achievable. Especially in microelectronics, the recent and upcoming advances in miniaturization will impose the needs for progress in methods of non-destructive testing. The growing number of connections in electronic circuits and components will result in a poor yield if no innovative testing methods would be applied.
Author(s)
Helfen, L.
Baumbach, T.
Banhart, J.
Stanzick, H.
Cloetens, P.
Ludwig, W.
Baruchel, J.
Mainwork
15th World Conference on Nondestructive Testing 2000  
Conference
World Conference on Non-Destructive Testing 2000  
File(s)
Download (468.08 KB)
Rights
Use according to copyright law
DOI
10.24406/publica-fhg-335843
Language
English
Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren IZFP  
Keyword(s)
  • micro-tomography

  • radiography

  • phase contrast

  • light material

  • composite

  • foam

  • fiber material

  • flip-chip

  • solder bump

  • metallization layer

  • hidden structure

  • wire bonding

  • glob top

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