Analysis of the influences of PCB process tolerances and assembly tolerances on 60 GHz radar sensor for Radar toolkit

For radar assemblies in the frequency range above 30 GHz, process selection and management are becoming increasingly important. The influence of the manufacturing process on the quality and performance of radar assemblies receives too little attention. This starts with the choice of surface finish for the PCB, continues with the effects of manufacturing tolerances and process variations in the PCB manufacturing area, and ends with the process control of the assembly process. The paper develops a methodology for linking material selection, process influences and design with the aim of providing assembly-specific design guidelines for a design suitable for manufacturing.