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  4. Advanced Micro-Dispensing System for Conductive Adhesives
 
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2001
Conference Paper
Title

Advanced Micro-Dispensing System for Conductive Adhesives

Abstract
As part of this paper, systems suitable for the micro-dispensing of conductive adhesives are presented and their advantages and disadvantages are also discussed. Additionally, cause-and-effect correlations of various influencing parameters are presented and analyzed, both for dispensing systems and for robotics. A further central theme is made up by the geometries of suitable needles for the precision dispensing of conductive adhesives. In closing, a new technique developed at the Fraunhofer IPA for the high-accuracy dispensing of conductive epoxy resins is presented. The most important part of the new system is a micro-pump system combined with pneumatic micro-valve actuators.
Author(s)
Gaugel, T.
Bechtel, S.
Neumann-Rodekirch, J.
Mainwork
Polytronic 2001, International Conference on Polymers and Adhesives in Microelectronics and Photonics. Proceedings  
Conference
International Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic) 2001  
DOI
10.1109/POLYTR.2001.973253
Language
English
Fraunhofer-Institut für Produktionstechnik und Automatisierung IPA  
Keyword(s)
  • micro-dispensing system

  • conductivity

  • conductive adhesive

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