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  4. Fiber-chip-coupling modules with up to 50 GHz modulation bandwidth and reusable fiber-chip-coupling mechanism
 
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2000
Conference Paper
Title

Fiber-chip-coupling modules with up to 50 GHz modulation bandwidth and reusable fiber-chip-coupling mechanism

Abstract
We designed and fabricated DIL-modules with a reusable optical coupling set-up, which is well suited for small-scale production and rapid prototyping of waveguide-fed InP and GaAs OEICs like diode lasers, semiconductor amplifiers and optical modulators. The light output of these OEICs is collected with high efficiency into tapered single mode fibers with a patented set-up. The modules are temperature controlled within an ambient range from 15 degrees C to 40 degrees C and electrical modulation signals up to 50 GHz can be fed via RF connectors to the OEIC.
Author(s)
Eckhardt, T.
Krips, O.
Fischer, U.H.P.
Mainwork
MICRO.tec 2000. VDE World Microtechnologies Congress: Applications - Trends - Visions. Proceedings. Vol.1  
Conference
World Microtechnologies Congress (MICROTEC) 2000  
Language
English
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
Keyword(s)
  • integrated optoelectronics

  • modules

  • optical fibre couplers

  • optical modulation

  • temperature control

  • thermal stability

  • fiber-chip-coupling modules

  • modulation bandwidth

  • reusable fiber-chip-coupling mechanism

  • dil modules

  • small-scale production

  • rapid prototyping

  • waveguide-fed InP oeics

  • waveguide-fed GaAs oeics

  • optical modulators

  • tapered single mode fibers

  • temperature controlled modules

  • rf connectors

  • 15 to 40 c

  • 50 GHz

  • InP

  • GaAs

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