2020
Presentation
Title

Beyond SIC Power Devices and Technology - Novel High Temperature SIC CMOS 1 Micron Technology

Title Supplement
Presentation held at 4th International Symposium on SiC Materials and Devices 2020, 26.11.2020, Busan, Republic of Korea
Author(s)
Erlbacher, T.  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Conference
File(s)
Rights
Use according to copyright law
DOI
Language
English