Pulse Magnetron Sputtering with High Power Density-Process and Film Properties

In this paper specific advantages and disadvantages of different pulse magnetron sputtering processes (unipolar and bipolar pulse sputtering at high and very high power density including HIPIMS) as well as current and potential fields of application will be discussed. On the examples of Ti and TiO2 the typical effects and their influence on film properties occurring during the transition from classical medium frequency pulse magnetron sputtering to high energy pulse sputtering (HIPIMS) and the influence on film properties will be described. The discharge current density was varied between 0.2 and 3.5 A/cm2. Aspects of energy feed-in, magnetron design and methods of reactive process control in the transition mode will be considered. Ideas for upscaling of the HIPIMS process will be discussed. Furthermore the influence of increasing ionisation on the occurrence of crystalline phases and on mechanical, optical and photocatalytic properties of the layers will be presented.