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Fracture and damage evaluation in microelectronic assemblies by FEA
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1999
Conference Paper
Title
Fracture and damage evaluation in microelectronic assemblies by FEA
Author(s)
Auersperg, J.
Michel, B.
Mainwork
Computational modeling and simulation of materials. Proceedings of Topical Symposium I on Computational Modeling and Simulation of Materials of the Forum on New Materials of the 9th CIMTEC World Ceramics Congress
Conference
Topical Symposium on Computational Modeling and Simulation of Materials 1998
CIMTEC, World Ceramics Congress & Forum on New Materials 1998
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
