Fatigue Delamination Study of Parylene as Electronic Packaging Material

Parylene has emerged as a promising substrate material in the development of electronic packaging due to its important dielectric properties, optical transparency, bio-compatibility, and mechanical flexibility. However, limited information exists regarding its performance and properties bonded to other packaging materials under cyclic loading, which is critical for long-term reliability. This study presents the development of a numerical-experimental method for characterizing the delamination behavior of parylene under fatigue conditions, essential for the design and simulation of electronic packaging. A fatigue cohesive zone model (FCZM) was formulated to describe the strength degradation of a Si-Parylene C interface and integrated to a finite element model of the sample structure. The parameters of the FCZM were calculated trough its fitting to experimental data from a custom setup.