TSV modeling considering signal integrity issues

Since a TSV has a metal-insulator-semiconductor structure, it supports three fundamental modes namely, skineffect, slow-wave and dielectric quasi-TEM mode. In this contribution, we predict the frequency range of these modes, considering TSVs for interposer applications as an example. Furthermore, the impact of Si-resistivity on signal integrity is quantified and coaxial TSV configurations are proposed to minimize this impact.