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Electroless Nickel/Copper plating as a new bump metallization
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1995
Journal Article
Title
Electroless Nickel/Copper plating as a new bump metallization
Author(s)
Aschenbrenner, R.
Ostmann, A.
Beutler, U.
Simon, J.
Reichl, H.
Journal
IEEE transactions on components, packaging and manufacturing technology. B
DOI
10.1109/96.386270
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
