English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Have you forgotten your password?
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
Measurement of thermal microdeformations in bumps
Details
Full
Export
Statistics
Options
Show all metadata (technical view)
1995
Conference Paper
Title
Measurement of thermal microdeformations in bumps
Author(s)
Kühnert, R.
Michel, B.
Mainwork
IEEE Workshop on Area Packaging Technologies '95. Proceedings
Conference
Workshop on Area Packaging Technologies 1995
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
