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Measurement of thermal microdeformations in bumps
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1995
Conference Paper
Title
Measurement of thermal microdeformations in bumps
Author(s)
Kühnert, R.
Michel, B.
Mainwork
IEEE Workshop on Area Packaging Technologies '95. Proceedings
Conference
Workshop on Area Packaging Technologies 1995
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
