Photonic system integration by applying microelectronic packaging approaches using glass substrates

Advanced photonic system-in-package (pSiP) technologies are proposed to enhance functionality of photonic packages featuring electrical, thermal and optical components including laser diodes, modulators, isolators, photonic integrated circuits, beam-splitters and micro lenses. We discuss thin glass as a suitable base material for packages made on panel level, precise glass structuring, electrical wiring and the related high precision assembly techniques. In particular, the concept is characterized in detail and proven by realizing the building blocks for a master oscillator power amplifier.