Low-temperature monitoring with implantation and alloying

Rapid thermal processing is one of the key thermal processes in semiconductor manufacturing. The temperatures and times at which they are carried out range from very low to extremely high temperatures for very short or long durations depending on the application. As the temperature–time cycle has changed radically over the years, manufacturing equipments need to be monitored for the stability of the manufacturing process. This paper examines and presents especially the complex monitoring process for low temperature processing by a defined implantation condition and an alloying method capable of monitoring processes at temperatures below 600 °C to ensure the process requirements of the manufacturing flow.