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  4. Influence of X-ray mask repair on pattern placement accuracy
 
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1990
Journal Article
Title

Influence of X-ray mask repair on pattern placement accuracy

Abstract
Compared to photomasks, X-ray masks are much more sensitive to mechanical damage, especially to process-induced distortions due to the use of thin silicon membranes (typically 2 mu m). One of several possible causes for such distortions is the repair of opaque defects using focused ion beams (FIB). The extent to which distortions are induced by the repair process has been investigated. Extensive experiments have shown that the repair process of opaque defects using focused ion beams does not significantly influence the pattern placement accuracy on X-ray masks.
Author(s)
Schaffer, H.
Weigmann, U.
Petzold, C.
Mescheder, U.
Journal
Microelectronic engineering  
Conference
International Conference on Microlithography: Microcircuit Engineering (ME) 1989  
DOI
10.1016/0167-9317(90)90108-6
Language
English
Fraunhofer-Institut für Siliziumtechnologie ISIT  
Keyword(s)
  • masks

  • X-ray lithography

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