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Passive Alignment Flip Chip Assembly Using Surface Tension of Liquid Solder and Micromechanical Stops
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2005
Conference Paper
Title
Passive Alignment Flip Chip Assembly Using Surface Tension of Liquid Solder and Micromechanical Stops
Author(s)
Oppermann, H.
Hutter, M.
Engelmann, G.
Reichl, H.
Mainwork
Reliability, packaging, testing, and characterization of MEMS/MOEMS IV
Conference
Conference "Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS" 2005
DOI
10.1117/12.600798
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
