Design and demonstration of a photonic integrated glass interposer for mid-board-optical engines

The paper shows the design and first experimental results of a hybrid integrated glass-silicon based interposer for data communication at a wavelength of 850 nm. All processes are carried out on wafer level followed by component assembly steps. This paper describes process development for HF lines, Through-Glass-Via metallization and optical interconnection necessary to create a glass-based interposer for mid-board-optics. The assembled interposer is measured for data rates up to 25 Gb/s and shows high tolerances for optical coupling.