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  4. Fully integrated Laser Doppler Vibrometer (LDV) based on hybrid 3D integration of silicon nitride and polymer photonic circuits with operation in the kHz regime
 
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2023
Conference Paper
Title

Fully integrated Laser Doppler Vibrometer (LDV) based on hybrid 3D integration of silicon nitride and polymer photonic circuits with operation in the kHz regime

Abstract
In this paper, we present the development of a miniaturized Laser Doppler Vibrometer (LDV) system, based on the 3D hybrid integration of the Si3N4 platform of LioniX (TriPleX) and the polymer platform of FhG-HHI (PolyBoard). The photonic integrated circuit (PIC) supports all the functionalities of an LDV system including the splitting of the input light to the measurement and the reference beam, the introduction of an optical frequency shift up to 100 kHz, polarization handling and detection of the reflected measurement beam, using a heterodyne detection technique. The optical frequency shift is accommodated in the TriPleX section of the PIC based on a simple serrodyne scheme, where a phase modulator is driven with a sawtooth signal with the desired frequency. The modulation of the optical field is based on the stress-optic effect utilizing thin-films of PZT deposited on top of the waveguide structures of the TriPleX platform, capable of supporting modulation frequencies up to several MHz. The PolyBoard part enables polarization handling and heterodyne detection of the reflected beam using micro-optic elements on chip, including a polarization beam splitter (PBS), a half wave plate (HWP), and a pair of balanced detectors with four photodiodes that are flip chip bonded on the top. The TriPleX and the PolyBoard platform were brought together based on the 3D hybrid integration, using mode size converters and vertical directional couplers with coupling losses lower than 15 dB. On-chip beating, using the integrated photodiodes is experimentally demonstrated.
Author(s)
Raptakis, Adam
Gounaridis, Lefteris
Kleinert, Moritz  
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
Weigel, Madeleine  orcid-logo
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
Epping, Jörn P.
Schreuder, Erik F.
Wolfer, Marco T.
Draebenstedt, Alexander
Pessina, R.
Groumas, Panos
Aukes, T.
Seyfried, Volker
Keil, Norbert  
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
Heideman, René G.
Avramopoulos, Hercules
Kouloumentas, Christos
Mainwork
Integrated Optics: Devices, Materials, and Technologies XXVII  
Project(s)
3D Photonic integration platform based on multilayer PolyBoard and TriPleX technology for optical switching and remote sensing and ranging applications  
Funder
European Commission  
Conference
Conference "Integrated Optics - Devices, Materials, and Technologies" 2023  
DOI
10.1117/12.2650027
Language
English
Fraunhofer-Institut für Nachrichtentechnik, Heinrich-Hertz-Institut HHI  
Keyword(s)
  • 3D photonic integration

  • hybrid integration

  • laser Doppler vibrometer

  • optical frequency shift

  • polymer platform

  • silicon nitride platform

  • stress optic modulation

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