2013
Conference Paper
Title

Applying a physics-based via model for the simulation of Through Silicon Vias

Abstract
This paper presents a first approach for the efficient modeling of Through Silicon Vias based on a Physics-Based Via model for application in silicon interposers with metallic boundaries.
Author(s)
Dahl, D.
Duan, X.
Beyreuther, A.
Ndip, I.
Lang, K.-D.
Schuster, C.
Mainwork
Conference
DOI
Language
English