Recent results and developments in temporary wafer bonding and -debonding on 300mm leading edge tools

Thin wafer handling is the key enabler for heterogeneous 3D-Wafer-Level-Integration. One example is the uprising Silicon Interposer, which is now widely accepted to be one of the most promising ways for heterogeneous 3D-Wafer-Level-Integration. As well as other TSV based integration schemes, these technologies require working with thinned wafers. Typically, an interposer, is 100mm thick, has TSVs with a diameter of 10mm and topology on both sides. An example for this topology, especially wafer debonding has to deal with, is a high density micro pillar array with tin cap (30mm height) for high I/O chip interconnects.