Development of a sensor concept to in situ measure process data in a transfer mold process
This paper presents the development of a sensor module, which can be subjected to a transfer molding process and measure in situ characteristic material properties and process parameters during the encapsulation process. Target application are large volume packages, as e.g. Smart Power Packages, where the in-mold behavior of molding compounds is crucial for high packaging quality. The application of an in situ measurement tool allows a live documentation, optimization and knowledge extension of transfer mold processes parallel to FEM simulation and ex-situ testing as DSC analysis. The paper describes the integration of the developed sensor system into the transfer molding process. With this system it is possible to achieve detailed information needed for an improved process understanding. In this way augmented process data available with today's molding systems are extended with the new in situ system.