Investigation of the Reliability of Electronic Components Under Combined Loads (Vibration, Humidity, Temperature)

This paper presents results on the analysis of a die attach under separate and combined loading. The analysis is based on a new method which is non-destructive and enables in-situ monitoring of degradation. Voids or cracks cause the change of thermal behavior in electronic packages, therefore the thermal behavior is due to alter over lifetime. This change is monitored for different loading conditions, which combine vibration, moisture and temperature.