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  4. Interface characterisation at electronic packages by means af nanoscale deformation analysis
 
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2014
Book Article
Title

Interface characterisation at electronic packages by means af nanoscale deformation analysis

Author(s)
Keller, J.
Zander, T.
Schulz, M.
Springborn, M.
Lauenstein, T.
Dost, M.
Wunderle, Bernhard  
Michel, Bernd  
Mainwork
Smart systems integration for micro- and nanotechnologies  
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS  
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