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Interface characterisation at electronic packages by means af nanoscale deformation analysis
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2014
Book Article
Titel
Interface characterisation at electronic packages by means af nanoscale deformation analysis
Author(s)
Keller, J.
Zander, T.
Schulz, M.
Springborn, M.
Lauenstein, T.
Dost, M.
Wunderle, B.
Michel, B.
Hauptwerk
Smart systems integration for micro- and nanotechnologies
Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS