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  4. Interface characterisation at electronic packages by means af nanoscale deformation analysis
 
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2014
Book Article
Titel

Interface characterisation at electronic packages by means af nanoscale deformation analysis

Author(s)
Keller, J.
Zander, T.
Schulz, M.
Springborn, M.
Lauenstein, T.
Dost, M.
Wunderle, B.
Michel, B.
Hauptwerk
Smart systems integration for micro- and nanotechnologies
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Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS
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