2004
Conference Paper
Title

Evolution of WLP: From Redristribution to 3-D Packaging and MEMS Packaging

Author(s)
Töpper, M.
Glaw, V.
Zoschke, K.
Jung, E.
Becker, K.-F.
Ehrmann, O.
Aschenbrenner, R.
Reichl, H.
Mainwork
Conference
Language
English