2004
Conference Paper
Titel

Evolution of WLP: From Redristribution to 3-D Packaging and MEMS Packaging
Author(s)
Töpper, M.
Glaw, V.
Zoschke, K.
Jung, E.
Becker, K.-F.
Ehrmann, O.
Aschenbrenner, R.
Reichl, H.
Hauptwerk
Konferenz
Thumbnail Image
Language
English