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Photo-Resist Technology for Wafer Level Packaging and MEMS Applications
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2005
Conference Paper
Title
Photo-Resist Technology for Wafer Level Packaging and MEMS Applications
Author(s)
Töpper, M.
Lopper, C.
Röder, J.
Hauck, K.
Baumgartner, T.
Reichl, H.
Tönnies, D.
Mainwork
15th European Microelectronics and Packaging Conference & Exhibition 2005. Conference programme & proceedings
Conference
European Microelectronics and Packaging Conference and Exhibition (EMPC) 2005
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
