Entwicklung von Prozessmodulen und in-situ-Meßmethoden für ein Flexibles Fotolithografisches Prozeßzentrum

Spin coating and development processes are a sequence of different process steps (cleaning, priming, spin coating, softbake, post exposure bake, developing, hardbake and cooling). Wafer tracks offer various possibilities to integrate in situ measurement simplifying the adaptation of closed loop process automation. these investigations allows for in situ measurement and real-time control of different process steps, not only feed forward and feed back control for single process steps but also optimization of the complete process sequence. The development, adaption and integration of new process techniques (e.g. proximity-tempering) into established equipment is possible in reduced times.