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Reliablitity investigations of fluxless flip-chip interconnections on green tape ceramic substrates
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1995
Conference Paper
Title
Reliablitity investigations of fluxless flip-chip interconnections on green tape ceramic substrates
Author(s)
Klöser, J.
Zakel, E.
Bechtold, F.
Reichl, H.
Mainwork
ECTC '95. 45th IEEE electronic components and technology conference. Proceedings
Conference
IEEE Electronic Components and Technology Conference 1995
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
