1996
Conference Paper
Title

The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach

Author(s)
Jung, E.
Giebler, R.
Klöser, J.
Dietrich, L.
Zakel, E.
Reichl, H.
Kasulke, P.
Ostmann, A.
Mainwork
Conference
Language
English
Keyword(s)