Reliability Improvement of Electronic Components: Influence of Design Parameters on Fatigue Life

The reliability of electronic components depends on many parameters. This work presents the results of an experimental Design of Experiments to investigate the influence of component and solder parameters on the solder fatigue life of QFN components on a Printed Circuit Board (PCB) for mechanical loads. On the on hand, the experiments showed a significant influence of both the number of leads and the percentage of the largest single void. On the other hand, the impact of total void percentage can be neglected in the investigated range and in terms of electronic functionality.