English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
Laser transmission bonding of silicon with titanium and copper layer for wafer-level packaging
Details
Full
Export
Statistics
Options
Show all metadata (technical view)
2012
Conference Paper
Title
Laser transmission bonding of silicon with titanium and copper layer for wafer-level packaging
Author(s)
Wissinger, A.
Schmitz, M.
Olowinsky, A.
Gillner, A.
Poprawe, R.
Mainwork
Semiconductor Wafer Bonding 12. Science, Technology, and Applications
Conference
International Symposium on Semiconductor Wafer Bonding - Science, Technology and Applications 2012
Pacific Rim Meeting on Electrochemical and Solid-State Science (PRiME) 2012
DOI
10.1149/05007.0189ecst
Language
English
Fraunhofer-Institut für Lasertechnik ILT
