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Metal injection moulding of tungsten and molybdenum copper alloys for microelectronic packaging
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2001
Conference Paper
Title
Metal injection moulding of tungsten and molybdenum copper alloys for microelectronic packaging
Author(s)
Petzoldt, F.
Knüwer, M.
Wichmann, K.-H.
Cristofaro, N. de
Mainwork
Advances in Powder Metallurgy & Particulate Materials 2001. Part 4: Powder injection molding (metals and ceramics)
Conference
International Conference on Powder Metallurgy & Particulate Materials (PM2TEC) 2001
Language
English
Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung IFAM
