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Finite Element Analysis for BEOL Stress Engineering to Improve Yield and Reliability of sub-30 nm Structures
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2013
Conference Paper
Title
Finite Element Analysis for BEOL Stress Engineering to Improve Yield and Reliability of sub-30 nm Structures
Author(s)
Kaulfersch, Eberhard
Brämer, Birgit
Rzepka, Sven
Breuer, D.
Cluass, E.
Feustel, F.
Mainwork
International Semiconductor Conference Dresden-Grenoble, ISCDG 2013
Conference
International Semiconductor Conference Dresden-Grenoble (ISCDG) 2013
DOI
10.1109/ISCDG.2013.6656314
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS
