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Capabilities of Incorporating Bulk Fracture, Bimaterial Interface Fracture and Fatigue Evaluation into RSM/DOE Concepts of Enhanced Microelectronics Applications
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2006
Conference Paper
Title
Capabilities of Incorporating Bulk Fracture, Bimaterial Interface Fracture and Fatigue Evaluation into RSM/DOE Concepts of Enhanced Microelectronics Applications
Author(s)
Auersperg, Jürgen
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Michel, Bernd
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Mainwork
7th International Conference on Electronics Packaging Technology 2006
Conference
International Conference on Electronics Packaging Technology (ICEPT) 2006
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
