2008
Conference Paper
Title

Hybrid flip-chip integration of a 40 Gb/s DPSK receiver comprising a balanced photodetector on a DLI-SOI board

Abstract
A DPSK receiver concept using flipchip hybrid integration of InP photodetectors on SOI boards with optical decoder is presented. Horizontal waveguiding enables low-cost production for high data rates.
Author(s)
Unterborsch, G.
Kroh, M.
Honecker, J.
Steffan, A.G.
Tsianos, G.
Bach, H.-G.
Kreissl, J.
Kunkel, R.
Mekonnen, G.G.
Rehbein, W.
Schmidt, D.
Bruns, J.
Mitze, T.
Voigt, K.
Zimmermann, L.
Mainwork
Conference
DOI
Language
English