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  4. Industrially feasible front-side metallization based on ink-jet masking and nickel plating
 
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2008
Conference Paper
Title

Industrially feasible front-side metallization based on ink-jet masking and nickel plating

Abstract
An alternative for an industrial front side metallization process for silicon solar cells is presented in this paper. Using ink-jet printing of a resist and wet-chemical acidic etching a structure is formed into the anti-reflection coating. The metallization is performed in two steps: first the formation of a seed layer by electroless nickel plating, followed by the growth of the contacts through light-induced silver plating. An evaluation of different steps in the process, like etching of the SiNx and formation of the silicide, is presented here. Industrial solar cells investigated in this paper show jsc ~35 mA/cm2, Fill Factor ~77 % and efficiencies up to 16.7 %.
Author(s)
Alemán Martínez, Mónica
Bay, Norbert
Gautero, J.
Specht, Jan
Stüwe, David
Neubauer, Rainer
Baurcha, D.
Biro, Daniel  
Rentsch, Jochen  
Glunz, Stefan W.  
Preu, Ralf  
Mainwork
The compiled state-of-the-art of PV solar technology and deployment. 23rd European Photovoltaic Solar Energy Conference, EU PVSEC 2008. Proceedings. CD-ROM  
Conference
European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) 2008  
File(s)
Download (477.29 KB)
DOI
10.24406/publica-r-361666
10.4229/23rdEUPVSEC2008-2DV.1.36
Language
English
Fraunhofer-Institut für Solare Energiesysteme ISE  
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