A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks

Over recent years the several decades long quartz-dominated timing industry has been continuously challenged by the introduction of new products or demonstration of prototypes based on MEMS resonators [1-4]. The poor intrinsic stability of such devices has led to the development of very high performance temperature sensors to reach TCXO-level frequency stability [5]. One of the true advantages of the technology is the fact that well-proven semiconductor manufacturing technologies amenable for high volume production can be leveraged to produce wafer-level encapsulated low-cost components. This paper explores how XTAL resonators could benefit from similar wafer level, vacuum sealing packaging technologies with the demonstration of a generic versatile timing module.