Analyzing mechanical stresses caused by temperature gradients using finite elements simulation

Temperature gradients in components and devices cause mechanical strain and stress. They are a main reason for failure or even breakdown of the components, especially if these loads occur periodically. The paper reports results of numerical simulations of temperature distributions inside the devices and the distribution of strain and stress in the different parts, materials and material combinations caused by temperature distribution and material parameters. The boundary conditions and heat flows are taken from separate studies about the irradiation of surfaces with different optical properties. With the help of these simulations, one can also identify regions with the highest possibility for a failure to occur, and optimize the design according to the requirements. Besides a possible change in geometry, the simulations help to check combinations of different materials and select materials with suitable properties. The described way to analyze components and devices can be implemented in a very early state of development. Thus, this approach is much faster and cheaper than experimental testing and can therefore help industries to reduce development time and costs. Entnommen aus <a_href="http://www.fiz-technik.de/db/b_tema.htm" target="_blank">TEMA</a>