1999
Conference Paper
Title

Reliability investigations of flip-chip solder bumps on palladium

Author(s)
Kallmayer, C.
Oppermann, H.
Kalicki, R.
Klein, M.
Anhöck, S.
Ostmann, A.
Aschenbrenner, R.
Reichl, H.
Mainwork
Conference
DOI
Language
English