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  4. AuSn solder in photonics assembly
 
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2009
Conference Paper
Title

AuSn solder in photonics assembly

Abstract
Why solder is attractive, as there also fluxless methods available like thermocompression bonding or adhesive joining? The liquid solder can accomodate for implanarities more than other bonding methods. Simple pick & place followed by a collective reflow process are prerequisites for low cost processes. To have no need for force during bonding is another advantage of soldering: e.g. for sensitive components with membranes or other fragile features as well as for 3D stacking.
Author(s)
Oppermann, H.
Mainwork
LEOS 2009, IEEE LEOS Annual Meeting Conference. Proceedings  
Conference
IEEE Lasers and Electro-Optics Society (LEOS Annual Meeting) 2009  
DOI
10.1109/LEOS.2009.5343468
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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