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  4. Packaging high-power diode laser bars using microchanneled copper mounts
 
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1998
Conference Paper
Title

Packaging high-power diode laser bars using microchanneled copper mounts

Abstract
High-power diode lasers with an average output power of several 10 W and above are growing into key components for modem laser systems and applications in e.g. materials processing and medicine. Solid state lasers strongly benefit from the higher laser beam quality, lifetime and reliability as well as from the lower energy consumption and floor space requirement which are possible if diode lasers are used instead of conventional lamps. In diode lasers for direct applications in e.g. soldering and plastics welding most of these advantages even become more evident.
Author(s)
Loosen, P.
Ebert, T.
Jandeleit, J.
Treusch, G.
Mainwork
LEOS '98. 11th Annual Meeting. Conference proceedings. Vol. 2  
Conference
IEEE Lasers and Electro-Optics Society (Annual Meeting) 1998  
DOI
10.1109/LEOS.1998.739800
Language
English
Fraunhofer-Institut für Lasertechnik ILT  
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